A leading semiconductor enterprise has long grappled with the issue of unexpected chip stacking during high-end chip manufacturing. This stacking problem not only causes frequent equipment downtime and process failures but also leads to mass rejection of high-value products, resulting in significant economic losses.​

Project Challenge：
Micron-level Precision Requirements: Detecting chip stacking, which typically increases the height by just a few hundred microns, demands extremely high measurement accuracy.​
High-speed Online Detection: The production line operates continuously at high speeds, requiring sensors with rapid response times to ensure seamless integration without disrupting the production rhythm.​
Harsh Production Environment: Sensors must be adaptable to clean conditions and withstand minor vibrations, maintaining stable and reliable performance.​
Non-contact Measurement: To prevent secondary damage or contamination, contact with the fragile chip surface must be avoided.​
Reliable Anomaly Detection: There is a need for precise differentiation between the reference height of a single-layer chip and the abnormal height of stacked chips.​
Solution​
To address the challenges of chip stacking detection, the high-precision Laser Displacement Sensor LC-S700RR leverages its core advantages of non-contact, high-speed, and accurate measurement to provide an efficient and reliable solution, ensuring smooth production line operation and product quality.​
Detection Principle and Core Advantages​
Precise Anomaly Capture: When chips are laid out in a single layer, the surface height is set as the reference value (carrier height + chip thickness). The LC-S700RR accurately measures the real-time height through laser reflection. Once the measured value significantly exceeds the reference range (indicating stacking), it immediately triggers an anomaly signal.​
Non-contact High-speed Measurement: The laser measurement method completely eliminates contact with the chip. Its ultra-fast response perfectly matches high-speed production lines, enabling 100% online detection.​
Extensive and Flexible Output: With a measurement range of up to 700±500mm, it can easily cover wide tracks or large carriers. It offers switch output signals (NPN/PNP switchable) for direct control of alarms or shutdowns, and RS485 communication for convenient data upload and system integration.​
Stable and Reliable Operation: Its robust design ensures long-term, trouble-free operation in semiconductor production environments.​
Typical Application​
Real-time Stacking Monitoring on Transmission Tracks: 
Chips are prone to accumulation and blockage due to static electricity or malfunctions during track transmission. By deploying the LC-S700RR above the track to continuously scan the cross-sectional height, when the sensor detects an abnormal height increase (stacking) in a local area, it immediately outputs an alarm signal, prompting timely intervention and effectively preventing production line interruptions and chip damage.​

Product Parameters of Laser Displacement Sensor LC-S700RR

​Measurement range: 700±500mm;

NPN/PNP can be freely switched;

Equipped with RS485 communication protocol;

Extended Application Scenarios​
Thickness/Height Sorting and Discrimination of Precision Components: Such as identification of molds and hardware parts or position detection.​
Monitoring of Large Coil Material Remainders: For example, precise measurement of the diameter of coils or the remaining film in the winding machines during new energy battery production.​
Flatness Detection of Flat Glass and Wafers