In the manufacturing process of modern electronic products, high speed, precision, and reliability are eternal themes. Automated production lines operate like sophisticated instruments, and the key to ensuring their smooth operation lies in countless "eyes" hidden within the equipment—various high-performance sensors. Today, let’s join us to explore the sensors applied in 3C electronic product manufacturing equipment!

High-Speed Digital Fiber Optic Sensor FM-E31 Series

Product Features

• Strong stability and high cost-effectiveness, with a maximum response speed of 50μs
• Flexible selection of four application modes (MEGA\SUPER\FINE\HIGH SPEED)
• Powerful function combination: automatic light gain, counting, zero shift, percentage setting, anti-light interference, area detection, rising/falling edge detection, DTM, NO/NC switching, delay, etc.

Aplication Scenarios

Missing material detection in component packaging lines, suitable for detecting small objects.

Applied Equipment

Assembly lines, wire bonders, tape and reel machines, IC testers, backlight laminating machines.

Ultra-Thin Background Suppression (BGS) Photoelectric Sensor UF-UB30 Series

Product Features

• Unique BGS function, enabling equal-distance detection of black and white objects
• Ultra-thin SUS304 stainless steel housing for superior protection performance
• Small blind zone
• Ultra-thin and compact design, adaptable to various narrow spaces

Application Scenarios

Mobile phone cover detection, in-place detection of small electronic components.

Applied Equipment

Board loaders, board flippers, board unloaders, assembly lines.

Compact Background Suppression (BGS) Photoelectric Sensor ZL-B12 Series

Product Features

• Unaffected by target and background colors, ensuring accurate object detection
• High precision with small differential distance, capable of detecting tiny step differences
• Small laser spot and compact size, suitable for narrow spaces
• Strong anti-interference ability, capable of resisting frequency-converted fluorescent lights through a unique external interference light avoidance algorithm

Application Scenarios

With excellent black-white color difference performance, the BGS series enables stable detection of trays or wafers.

Applied Equipment

Board loaders, board flippers, board unloaders, assembly lines.

Square Background Suppression (BGS) Photoelectric Sensor ZL-BL20N (Strip Spot)

Product Features

• Strip spot design for stable detection of various perforated PCB substrates
• Perfect application of BGS function, unaffected by target and background colors

Application Scenarios

Reliable detection of various PCB boards, widely used in the 3C industry; low sensitivity to target color differences (black and white), ensuring high practicality in operating scenarios.

CMOS Laser Displacement Sensor LC-S Series

Product Features

• Three detection distances optional: short, medium, and long
• Compact size, small light spot, and high precision
• Multiple output functions: single switching output, dual switching & analog output, RS485 communication output, etc.
• Various functions and detection modes, applicable to more application scenarios

Application Scenarios

Presence/absence detection of micro flat washers.

Applied Equipment

Assembly lines.

The development of sensor technology has brought unlimited possibilities to the 3C electronics industry. The application of sensor solutions has become an indispensable part of 3C electronic product production, empowering lean and efficient automated manufacturing.